Residual stress and microhardness increasing induced by two-sided laser shock processing
Gerontiy Sakhvadze1 , Alexander Shokhin2 , Omar Kikvidze3
1, 2Blagonravov Institute of Machines Science, Russian Academy of Sciences, Moscow, Russia
3Tsereteli State University, Kutaisi, Georgia
Vibroengineering PROCEDIA, Vol. 8, 2016, p. 434-439.
Received 26 July 2016; accepted 3 September 2016; published 7 October 2016
Two-sided laser shock processing (TSLSP) is often employed to improve the surface quality of thin section components, which can reduce excessive plastic deformation induced by one-sided laser shock processing. Residual stresses (RS) ﬁeld induced in a thin Ti-6Al-4V alloy plate by TSLSP was investigated through numerical simulation. The multiple TSLSP impacts and the increasing laser shock pressure were found to have signiﬁcant effects on the RS ﬁeld. Microhardness distribution on the section of specimen, calculated from RS by Carlsson-Larsson model, is analyzed
Keywords: two-sided laser shock processing (TSLSP), finite element method (FEM), residual stresses (RS) ﬁeld, microhardness, shock wave pressure, multiple laser shocks.
The work is financially supported by the Ministry of Education and Sciences of the Russian Federation within the federal target Program “Studies and Developments of Promising Trends in Russia’s Science and Technology Sector for 2014-2020”. Subsidy Agreement No. 14.607.21.0040 of July 22, 2014, Project RFMEFI60714X0040.
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