The effect of dry friction forces on the process of dielectric wafer grinding

L. A. Igumnov1 , V. S. Metrikin2 , A. V. Grezina3 , A. G. Panasenko4

1, 2Research Institute for mechanics, National Research Lobachevsky State University of Nizhni Novgorod, Nizhny Novgorod, Russia

3, 4National Research Lobachevsky State University of Nizhni Novgorod, Nizhny Novgorod, Russia

2Corresponding author

Vibroengineering PROCEDIA, Vol. 8, 2016, p. 501-505.
Received 25 May 2016; accepted 3 September 2016; published 7 October 2016

Copyright © 2016 JVE International Ltd. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Creative Commons License

We have investigated possible motions of the holder on top of the polishing pad during the process of dielectric plate grinding taking into account the forces of dry friction about its axis. A mathematical model of the mechanical device has been elaborated to describe the process of dielectric wafer grinding. The model is in the form of a non-autonomous nonlinear system with a variable structure. The structure of the phase space of the dynamical system was investigated, the qualitative studies of the possible motion modes were carried out. The values of the geometrical and dynamic parameters that qualitatively and quantitatively influence the modes of the holder motion were obtained. It was found that the inclusion of dry friction forces on the axis of the free holder result in a periodic motion of the mechanism with long stops. We present the calculations of the parameters for the type 3PD-320 machine.

Keywords: grinding, friction, mathematical model, phase space, holder, regimes with a long stop.


Development of mathematical model is financially supported by Russian Science Foundation, project No. 16-19-10237. Investigation of numerical results was financed within the framework of the base part of State Task of the Ministry of Education and Science Project, No. 2014/134 2226.


  1. Khomich N. S., Lugovik А. Yu., Fedortsev Р. V., Korzun A. E., Kukhto P. V. Simulation of the kinematics of the process of magnetic abrasive polishing of wafers. BSTU Herald, Vol. 1, 2009, p. 33-38, (in Russian). [CrossRef]
  2. Gavrishuk Е. М., Komarovv N., Metrikin V. S., Panasenko А. G. Mathematical of wafer grinding on the machines of type 4PD-200 and 3PD-320. Bulletin of the Samara SC RАS, Vol. 13, Issue 1, 2011, p. 992-995, (in Russian). [CrossRef]
  3. Nanz G., Camille L. E. Modeling of chemical-mechanical polishing: a review. IEEE Transactions on Semiconductor Manufacturing, Vol. 8, Issue 4, 1995, p. 382-389. [CrossRef]